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Products > Semiconductor
Equipment |
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 SAWING & PLACEMENT-20000D |
High productivity : 20,000 UPH
(unit/hour)
Individually operating dual chuck sawing cut cprocess
Multiple unit handling system
Automatic picker pitch-adjustment function
Installed supreme vision inspection system
Suitable for small size package handling (QFN
2x2)
Conceptual innovation to handle for zero ball
margin for BGA with Super Lee Pad
Extremely quick & easy conversion
Dual tray carrier system
Solutionf or handling warped substrate & bent
tray
Higher machne durability & efficiency with
casting body concept |
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| Productivity |
UPH |
unit/hour |
20,000 (based on cycle run) |
| Application |
Substrate Size |
mm |
35~75(W) x 150~250(L) |
| Magazine Stack |
mm |
600 (M/Z buffer station) |
| Warpage |
mil |
Max. 40 (1.00mm) |
| System Reliability |
MTBA |
hours |
2~5 |
| MTBF |
hours |
168 |
| MTTA |
minutes |
Max. 3 |
| MTTR |
minutes |
Max. 30 |
| Dimension |
mm |
3,547(W) x 1,612(L) x 1,800(H) |
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| * This
product of HANMI Semiconductor is protected by the property
right of industry. |
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