|
|
 |
 >
Products > Semiconductor
Equipment |
 |
 |
 |
|
|
|
|
|
|
|
 LASER CUTTING-3000 |
|
 |
| LASER CUTTING-3000 |
High productivity : 12,000 UPH
(unit/hour)
Field proven excellent cutting quality (drastic
reduction of the number of laser emission through
the high power laser)
Capability for handle Micro SD Card & other
memory card packages
Excellent dust collection & cleaning system
Easy to use graphical interface
Lowest cost-of-ownership
Installed advanced & high performance vision
inspection system
|
|
|
|
 |
| for Micro-SD Card, SD Card, MMC, xD Card, SIM Card, SD SIP, TransFlash¡¦ |
 |
| Productivity |
UPH |
unit/hour |
12,000 (based on Micro SD Card & curved-line cutting) |
| Application |
Substrate Size |
mm |
30~80(W) x 160~250(L) |
| Package Size |
mm |
2x2~27x27 |
| Substrate Thickness |
mm |
Max. 2 |
| System Reliability |
MTBA |
hours |
2~5 |
| MTBF |
hours |
168 |
| MTTA |
minutes |
Max. 3 |
| MTTR |
minutes |
Max. 30 |
| Dimension |
mm |
2,450(W) x 2,100(L) x 1,850(H) |
|
| *This
product of HANMI Semiconductor is protected by the property
right of industry. |
|
|
|
