SAWING & PLACEMENT-20000D SAWING & PLACEMENT-3500DS SAWING & PLACEMENT-3800L SAWING & PLACEMENT-3500F     SAWING & PLACEMENT-3500DS High productivity : 15,000 UPH Best solution for small size package (QFN 2x2 / BGA 2.5x2.5 : 25,000 UPH) Easy & quick conversion : max. 9 minutes Solution for machine vibration 3 point vision positioning Best solution for warped strip & bent tray Automatic vision teaching function Precise unit placement accuracy Vision System 1st Vision Orientation, package type, turnover 2nd Vision Package outline dimension, ball quality, lead/pad quality 3rd Vision Marking quality Application Substrate mm 35~75(W) x 170~250(L) Weight MTBA hour 2~5 MTBF hour 168 MTTA minutes Max. 3 MTTR minutes Max. 30 * This product of HANMI Semiconductor is protected by the property right of industry.