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Products > Semiconductor
Equipment |
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 BALL PLACEMENT-2000 |
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| BALL PLACEMENT-2000 |
Automatic flux and ball feeding
Automatic cleaning of fluxing tool
Quick and Easy conversion with 5 minutes.
Automatic alignment and offset adjustment (PRS)
High productivity: cycle time of 10 sec/strip
Warpage Compensation function. |
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| Vision System |
1st Vision |
Substrate Orientation, Package Type, Auto alignm |
| 2nd Vision |
Flux Tool Inspection |
| 3rd Vision |
Ball Tool Inspection |
| 4th Vision |
Ball quality, Position, final Inspection |
| Flux Dotting |
Pin dotting |
| Ball Mounting |
Vacuum pick up & ejection type |
| Cycle Time |
10 Sec/Strip |
Applicable Range
- Solder Ball Size
- Solder Ball Pitch
- Substrate Dimension |
Over 0.3 mm
Over 0.5 mm
35~100 x 160~250 mm(WxL) |
| Ball Mounting Accuracy |
¡¾ 0.05 mm ( ¡¾ 2 mil) |
| Conversion Time |
below 5 Min |
| Machine Dimension |
2,350 x 1,300 x 1,560 mm (LxWxH) |
| Machine Weight |
1,800 kg |
| Air Supply |
Over 50 PSI |
| Power Supply |
200~450VAC, 50/60Hz, 3 Phase |
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| * This
product of HANMI Semiconductor is protected by the property
right of industry. |
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