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Products > Semiconductor
Equipment |
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 FLIP CHIP BOND |
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| FLIP CHIP BOND A110 |
High Accuracy with X-Y Gantry Structure.
High Productivity with Dual Bonding Head.
Capable of handling 12inch wafer.
Extremely Easy Conversion & Maintenance.
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| Productivity |
UPH |
5,000 (Real Production) |
| Accuracy |
X-Y placement |
±10.0 µm @ 3 σ |
| Chip rotation (θ) |
±0.1° @ 3 σ |
| Bonding Head |
Bonding force |
1N ~ 25N (Programmable from 1N) |
| Footprint |
Dimension (WxDxH) |
1,730mm x 1,200mm x 1,500mm |
| weight |
3,000kg |
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This product of HANMI Semiconductor is protected by
the property right of industry. |
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