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Products > Semiconductor
Equipment |
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 FORM GRINDING-3000 |
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| FORM GRINDING-3000 |
UPH : Min. 5,000
High Productivity owing to multiple unit processing
Excellent form grinding cut quality (Roughness
: Max. 1.5Ra)
High effective cleaning & drying system
Advanced vision inspection system with sorting
function
Minimized cost of ownership |
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| for Micro-SD Card, SD Card, MMC, xD Card, SIM Card, SD SIP, TransFlash… Excellent Quality, Roughness : Max 1.5 Ra |
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| Vision Inspection |
1st Vision |
Lead Count, Lead Width, Lead Length, Lead Pitch, Package Size, Dimension, Offset, X-Mark, Chamfer Dimension |
| 2nd Vision |
Wrong Character, Mark Position, X-Mark, Package Size, Chip Out, No Mark, Scratch, Missing Character, Edge Around Angle |
| Dimension |
3,030 × 1,780 × 1,800 (L × W × H) |
| Weight |
2,400 KG |
| Power supply |
220~440VAC, 50/60Hz |
| Air supply |
5Kgf/cm2 at 800L/min |
| Water supply |
3Kgf/cm2 at 6L/min |
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| * This
product of HANMI Semiconductor is protected by the property
right of industry. |
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