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Products > Semiconductor
Equipment |
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 AUTO MOLD S-1000 |
Variuos press clamping tonnage
up to 175tons
Independent molding with modular concept up to
4 modues
Field proven excellent moding quality (void free
& minimum wire sweep)
Capability for Top Pin Gate modling
- Solution for thin package, non-metal substrate
& high pin count package molding
- No runner & no gate remain
- Suitable for PoP (Pacakge on Package) &
smartcard
- High durability & efficiency by casting
body
- Continous machine running even during maintenance
& cleaning
- Conceptual innovation for dust free machine
design
- Compound detection by loadcell
- Lot travel checking & tracing by RFID sensor
& barcode reader |
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| Application |
Lead Frame |
mm |
20~83(W) x 100~280(L) |
| Magazine |
mm |
Max. 85x280x170(input slotted, WxLxH)
Max. 850x295x450 (output stack, WxLxH) |
| Machine Time |
sec |
Max. 2 |
| Molding Compound |
Diameter |
mm |
¥Õ13 ~ ¥Õ20 |
| Size |
mm |
Max. ¥Õ20 (H:28) |
| EMC Ratio |
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90% |
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| * This
product of HANMI Semiconductor is protected by the property
right of industry. |
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