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CROPPED INGOT INSPECTION SYSTEM INGOT & GLASS BONDING SYSTEM WAFER SPLITTER
 
DEMOUNT &PRE-CLEANING SYSTEM FINAL-CLEANING SYSTEM
 
WAFER INSPECTION & SORTING SYSTEM AUTO PACKING SYSTEM
 

Cropped Ingot Inspection System
- ÆíÃø ¿¬»è°¡°øÀÌ ¿Ï·áµÈ PV IngotÀÇ ÀüÀÚµ¿ °Ë»çÀåºñ
- ³ôÀº »ý»ê¼º : 40 Ingot/hour (90ÃÊ cycle time)
- Á¤¹ÐÇÑ Ingot ÃøÁ¤ ¹× °Ë»ç
- ±â°èÁ¤¹ÐÁ¦¾î ±â¼úÀ» ÀÌ¿ëÇÑ ¾ÈÀüÇÑ Ingot Handling
- »ç¿ëÀÚ Áß½ÉÀÇ Graphical Interface & Touch Screen LCD Monitor ±¸Ãà
- ´Ù¼öÀÇ IngotÀ» ÀûÀçÇÏ°í Çڵ鸵ÇÏ´Â ¸ÞÄ¿´ÏÁò ±¸Çö
- ´Ü°áÁ¤/´Ù°áÁ¤ Silicon Ingot ¸ðµÎ¸¦ ó¸®ÇÒ ¼ö ÀÖ´Â ÀåºñÀÇ À¯¿¬¼º º¸Àå
Inspection Item & Specification
-°Ë»çÇ׸ñ : Ingot ³»Ãø Ä¡¼ö (Crack, Chip-Out : Optional)
-Camera : 4Mega Pixel °íÇØ»óµµ Ä«¸Þ¶ó
-Lens : Telecentric Lens

 
   

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