| 1999's |
| Application of SECS/GEM Communication
Protocol to semiconductor equipment. |
| Laser Marking T/F/S Inline system
of F. Corporation in Malaysia . |
|
 |
| 2000's |
| Support of HSMS(TCP/IP) Protocol
which is substituted for SECS-I(RS-232) |
|
|
| 2002's |
| Application of GEM scenario in the
basis of HSMS Protocol. |
| Application of whole GEM scenario
to Trim/Form system of S. Corporation in Singapore
. |
| Factory Automation in whole manufacturing
line is realized by application of GEM scenario,
which is applied for the equipment with specialization,
to Trim/ Form system using the HSMS Protocol which
is used for high-speed data communication. |
| |
|
|
| 2003's |
| Application of SECS/GEM Communication
Protocol using other company equipment and HCIM-100S
controller. |
| Support of whole GEM scenario to
Trim/Form system of S. Corporation in Singapore.
|
|
|
| 2004's |
| Applicartion of SECS/GEM Communication
Protocol using the HCIM-200S to many overseas
companies. |
| Support of whole GEM scenario to
Sawing & Placement system of I. Corporation
in Singapore . |
| Support of whole GEM scenario to
Trim/Form system of N. Corporation in Singapore
. |
| Laser Marking T/F/S Inline system
of F. Corporation in Malaysia . |
| Consultation for SECS/GEM Communication
support in semiconductor manufacturing line of
S. Corporation in korea . |
| Consultation for mapping and SECS/GEM
Communication support for Pick & Placemet
system of N. Corporation in Thailand . |
| Support of whole GEM scenario to
Trim/Form system of S. Corporation in Singapore
. |
| ¡Ø Support of remote monitoring using
the HCIM-EMS Controller to Sawing & Placement
System of S. Corporation in China . |
|
|
| 2005's |
| Support of Wafer Level Mapping and
GEM scenario to Pick & Place System of S.
Corporation in korea . |
| Construction of interface to Sawing
& Placement system for integration with Dicer.
sub-system of the Sawing & Placement, of M.
Corporation in Singapore . Support of whole GEM
scenario. |
| Consultaion for SECS/GEM Communication
support for Sawing & Placement system of H.
Corporation in korea . |
| Support of whole GEM scenario to
Trim/Form system of S. corporation in Singapore
. |
| Construction of interface to Sawing
& Placement system for integration with Dicer.
sub-system of the Sawing & Placement. of I.
Corporation in Portugal . support of whole GEM
scenario. |
|
|
| |
|
| |
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