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Received the 2005 Technology Frontier Award |
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2005-06-20 |
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6057 |
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On April 21, 2005, Sawing & Placement System 3000D of HANMI Semiconductor Certified as the 2005 Technology Frontier Award from Korean Standards Association. This system is handling the Chip Scale Package which is one the latest version among the IC chips to singulate the units after molding process and it simplify the several manufacturing process such as cutting, feeding, inspection & unloading. Hanmi Semiconductor has registered & applied about 29 patents for this equipment in domestic & international area and enhance the competitiveness by using about 70% of components made in domestic area. This system has been delivered to most of the major semiconductor manufacturing companies in domestic & overseas area. Also, it has been continuously delivered to the existing & new customers due to outstanding performance, high productivity & easy operation.
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