HANMI Semiconductor said on Oct. 17th, (Thursday) that it posted 152 million dollars in sales and 72 million dollars in operating profit in the third quarter of this year. It achieved its highest quarterly performance since its foundation.

It has accumulated 300 million dollars in sales and 134 million dollars in operating profit this year.

HANMI Semiconductor expects continued sales growth due to full-scale delivery of TC BONDER for HBM, which is the core of artificial intelligence (AI) semiconductors that begun from the third quarter of this year, and expansion of new plants exclusively for HBM TC BODNER, which is being pursued to be completed by the end of next year.

Kwak Dong Shin, CEO & vice chairman of HANMI Semiconductor, said, “Currently, HANMI Semiconductor has the largest market share in TC BONDER for HBM,” adding, “It is thanks to our continuous efforts to satisfy customers based on our 45 years of business and know-how accumulated since its establishment in 1980.”

HANMI Semiconductor operates an After Service team dedicated to SK Hynix and an After Service team dedicated to Micron Technology’s Taiwan plant.

Kwak Dong Shin vice chairman said, “There is a saying in the UK that ‘For want of a nail’,” and also he added, “It is a story that you lose the war because you can’t use your horses’ hooves because you don’t have a nail.” He explained, “I assume that TC BONDER is a very important core process equipment in HBM production, which is the core of artificial intelligence (AI) semiconductors,” he said. “ASMPT, which competes with HANMI Semiconductor, has producing equipment at factories in Shenzhen and Chengdu, China, so it lags behind HANMI Semiconductor equipment, which is ‘Made in Korea,’ in terms of assembly quality and equipment performance.”

“We expect that the demand for AI-exclusive chip (HBM) development by U.S. big tech companies will keep increase,” he said. “We are selecting an agent that established in U.S. and provide After Service to U.S. local customers who will emerge as major customers in the AI semiconductor market.”

HANMI Semiconductor singed a trust contract last month to acquire 30-million-dollar worth of treasury stocks based on improved shareholder value and confidence in future value in the artificial intelligence (AI) semiconductor market. It has acquired treasury stocks worth a total of 175 million dollars since last year.

Since the first half of this year, HANMI Semiconductor has been developing Mild Hybrid BONDER for sixth-generation HBM4 production from the request of global semiconductor manufacturers. HANMI Semiconductor is expected to solidify its exclusive position also in Mild Hybrid BONDER based on its technology and know-how that ranks No.1 in TC BONDER for HBM global market share.