HANMI Semiconductor announced on the 4th that they have introducing ‘7th generation new micro SAW & VISION PLACEMENT 6.0 GRIFFIN’ for the first time and have participating as an official sponsor in 2024 SEMICON Taiwan.

The 7th generation new micro SAW & VISION PLACEMENT is a key equipment representing HANMI Semiconductor along with TC BONDER for artificial intelligence semiconductor HBM. After seven years of research, HANMI Semiconductor had dramatically improved its performance. It is possible to reduce management costs and burdens caused by equipment operating.

Since the first generation model launched in 1998, it has been delivered to the world’s leading semiconductor companies and has been receiving a lot of trusts from the world. And also, it is known as the world’s best product, which has been ranked No.1 in global market share for 20 consecutive years from 2004 to last year.

A HANMI Semiconductor relative said, “the 7th generation new micro SAW & VISION PLACEMENT, which is an agglomeration of high-techs with a total of 270 patents, has increased productivity and precision compared to previous models.” And he also said, “We have newly added BladeChangeMaster, Auto Kit Change and Full Self Device Setup, which are unmanned automation technologies for equipment.”

HANMI Semiconductor, possessing the largest scale of market share in the world of TC BONDER for artificial intelligence semiconductor HBM, expected its performance to improve due to the launch of the 7th generation new micro SAW & VISION PLACEMENT.

HANMI Semiconductor has been delivering TC BONDER for HBM, which it won orders from customers, in earnest from the third quarter. They expect to achieve its sales target of 490 million dollars this year. They also promote a business of a plant establishment with a total floor area of 33,000㎡. Besides, they predict that it will be able to achieve its sales target of 1.5 billion dollars in 2026.