HANMI Semiconductor introduced ‘HBM 6-SIDE INSPECTION 1.0’ equipment, which is essential for manufacturing ‘high-bandwidth memory (HBM)’ for artificial intelligence (AI) semiconductors.

According to HANMI Semiconductor on the 15th, the ‘HBM 6-SIDE INSPECTION 1.0’ equipment is an equipment that minimizes the defect rate through vision inspection of six-side around semiconductor chips stacked by Through-Silicon Via (TSV) method.

Kwak Dong Shin, vice chairman of HANMI Semiconductor, said, “This equipment is characterized by significant improvement in productivity and inspection precision to increase HBM yield.” And also, “It will be a major equipment that contributes greatly to future sales along with DUAL TC BONDER that stacks DRAM memory semiconductor chips vertically.”

Since the creation of the Intellectual Property Department in 2002, HANMI Semiconductor has operated about 10 professionals and focuses on protecting and strengthening intellectual property rights. So far, it has applied for more than 120 HBM equipment patents, including 111 patents. Based on the fact, it aims to gain the upper hand with its own technology and durability and also further increase the competitiveness of HBM equipment.

Since the second half of last year, HANMI Semiconductor has won orders for DUAL TC BONDER GRIFFIN equipment, an essential HBM processing equipment, from SK Hynix for more than USD 150 million. Recently, it signed a contract with new customer of the U.S. to supply DUAL TC BONDER equipment as USD 16 million.

An official of HANMI Semiconductor added, “We have proven to be a leading company in the HBM equipment industry, which is the core of artificial intelligence (AI) semiconductors, by trading with all but SAMSUNG Electronics among the world’s ‘Big Three’ memory semiconductor manufacturers.”