HANMI Semiconductor launched ‘DUAL TC BONDER TIGER’, an essential process equipment for HBM (High-bandwidth memory) for AI (Artificial intelligence) semiconductors, on the Apr, 1st.

"Kwak Dong Shin, vice chairman of HANMI Semiconductor, said, “DUAL TC BONDER TIGER is a bonding equipment that stacks semiconductor chips made by the TSV method on wafers with the latest technology applied to meet global semiconductor customer requirements.” And also, “The DUAL TC BONDER for HBM production, which is currently the core of AI semiconductors, is provided with hyper model GRIFFIN and premium model DRAGON according to the needs and specifications of customers,” he said. “We expect sales to increase this year with the addition of TIGER, an extra model.”"

Since the establishment of the Intellectual Property Department in 2002, HANMI Semiconductor is currently focusing on protecting and strengthening intellectual property rights through a dedicated department consisting of about 10 professionals. So far, it has applied for a total of more than 110 patents for HBM equipment. It is expected that it will gain an advantage with its unrivaled technology and durability, and that its equipment will become more competitive.

According to a recent Hyundai Motor Securities report, it is expected that the U.S. demand for DUAL TC BONDER of HANMI Semiconductors for HBM production, which is the core of AI semiconductors, will be keep increasing.

Kwak Min-jeong, a researcher at Hyundai Motor Securities, raised the target price of HANMI Semiconductor from KRW 130,000 to KRW 200,000. “We predict that demand for inspection equipment will continue to increase along with demand for TC BONDER equipment for HBM,” she said. “According to United States Department of Commerce, we will present a 55-layer HBM roadmap by 2035 and build supply chains in U.S. for five years.” And also she emphasized, “The ‘On Shoring Strategy’ initiative based on the TSMC-SK Hynix-NVIDIA alliance will serve as a major growth engine for HANMI Semiconductors.”