original article HANMI Semiconductor's Highest Dividend Since Its Foundation..."Expanding sales of HBM equipment" HANMI Semiconductor announced on the 13th that they will allocate 420 won per share, a total of 40.7 billion won, as cash dividends for fiscal 2023. This is the largest since the company's founding, exceeding the total dividend of 29.7 billion won in 2021. Dividends were revised as of March 7 every year in accordance with the revision of the articles of incorporation in March. Shareholders seeking dividends must hold shares of HANMI Semiconductor on March 7, 2024. DS Kwak, vice chairman of HANMI Semiconductor, said, "Starting with the announcement of the largest dividend of 40.7 billion won, we will continue to expand our dividend payout ratio in the future." In September this year, HANMI Semiconductor received orders of about 101.2 billion won from SK Hynix for the first time in a month, reviving its growth. This is due to the continued orders for the third-generation hypermodel "DUAL TC BONDER GRIFFIN" for essential production equipment for high-bandwidth memory(HBM) for an artificial intelligence(AI) memory. DS Kwak also said, "We aim to have annual sales of 450 billion won in 2024, and we expect to have annual sales of 650 billion won in 2025." According to the industry, HBM's production is also on the rise as orders centered on large fabless companies such as NVIDIA and AMD increase. SK Hynix announced an investment of 10 trillion won in 2024 to expand HBM facilities, and Samsung Electronics also decided to increase production by more than 2.5 times by advancing investment in expanding packaging lines in preparation for a surge in HBM demand. Micron is also planning to mass-produce HBM3E within the first quarter of next year as it has completed preparations for mass-production. Meanwhile, DS Kwak paid 30 billion won in treasury stock to employees in October.
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