HANMI Semiconductor, a semiconductor equipment company, has announced on the 4th that they had received KRW 59.617 billion worth of ‘DUAL TC BONDER GRIFFIN’ equipment order from SK Hynix.

Following the order of ‘DUAL TC BONDER 1.0 DRAGON’ worth KRW 41.565 billion with SK Hynix on the 1st of last month, the accumulated order recorded more than KRW 100 billion in a month.

DUAL TC BONDER 1.0 GRIFFIN is a 3rd generation essential process equipment model of HBM (High-Bandwidth Memory) that is installed in artificial intelligence semiconductors.

DS Kwak, vice chairman of HANMI Semiconductor, said “DUAL TC BONDER GRIFFIN is a 3rd generation hyper-bonding equipment that increases productivity and precision to stack semiconductor chips for next-generation HBM.”

HANMI Semiconductor is providing GRIFFIN, a DUAL TC BONDER hyper model, and DRAGON, a premium model as what customer needs and specifications.

Vice chairman DS Kwak, the largest shareholder of HANMI Semiconductor, has additionally bought a total of KRW 14.8 billion from this July to purchase 282,300 shares of the company. He now has 35.78% of shareholding.

HANMI Semiconductor, founded in 1980, participates in global semiconductor equipment exhibition, ‘SEMICON China’ held in Shanghai, China and ‘SEMICON Taiwan’ held in Taipei, Taiwan every year as an official sponsor.

Recently, HANMI Semiconductor has introduced ‘TC BONDER CW (Thermo-Compressor Bonder Chip to Wafer)’, a 2.5D package type which can be applied to TSMC CoWoS (Chip on Wafer on Substrate) packages, and keep maintains global marketing activities with related customers such as ASE, Amkor and SPIL.’