HANMI Semiconductor, a semiconductor equipment company, has introduced next-generation high-bandwidth memory (HBM) that is installed in artificial intelligence (AI) semiconductors.

According to HANMI Semiconductor on the 19th, the third-generation hyper model ‘DUAL TC BONDER GRIFFIN’ is released and will be delivered to global semiconductor company.

DS Kwak, vice chairman of HANMI Semiconductor, said, “The equipment introduced this time is a 3rd-generation hyper model of bonding equipment that stacks semiconductor chips manufactured by the ‘TSV’ method on wafers with the latest technology.”

He added, “It is characterized by a significant improvement in productivity and precision for stacking semiconductor chips for next-generation HBM production.” Also, “DUAL TC BONDER will greatly contribute to next year’s sales, focusing on hyper model ‘GRIFFIN’ and premium model ‘DRAGON’.”

Vice chairman DS Kwak has invested a total of KRW 12.4 billion since July to purchase 232,300 additional shares of the company, increasing his stake to 35.75%. An official from HANMI Semiconductor explained, “The growth of the artificial intelligence (AI) market and the continuous launching series of equipment for HBM show confidence in the future performance of HANMI Semiconductor.”

HANMI Semiconductor has applied for a total of 106 patents for bonding equipment (including scheduled applications). Based on this, it plans to gain the upper hand with its state of the art technology and durability and further increase its competitiveness in equipment.