HANMI Semiconductor announced on the 16th that they launched ‘micro SAW GL1121’ and started to supply to overseas clients, the first ‘Full-automation glass micro SAW’ in the industry which sawing lenses, filters, and glass that go into the electronic device.

DS Kwak, CEO & vice chairman of HANMI Semiconductor said that "This ‘micro SAW GL1121’ is a device that sawing lenses, filters, and glass by using ‘loader’ and ‘chuck table’ for the first time in the field. By applying ‘All-in-one solution’ that innovatively simplifies the existing multi-step process, so can speed up 'UPH' (Unit Per Hour), improve productivity, and reduce costs."

He added, “We are providing 2-year warranty to all micro SAW equipment. It can create synergy effects when combined it with ‘VISION PLACEMENT’, the No.1 equipment in the industry. We expect that this glass micro SAW equipment will generate new sales separately from existing micro SAW equipment.”

Earlier in June last year, HANMI Semiconductor launched ‘Dual-chuck micro SAW’, which was first localized in Korea. They then released ’20-inch micro SAW for Jumbo PCB’ in October and ’12-inch micro SAW’ equipment in December, and currently ‘Tape micro SAW’ in March of this year.

This glass micro SAW is the fifth micro SAW model. HANMI Semiconductor is planning to become as micro SAW equipment specialized company through this. In a related development, they won the ‘IR52 Jang Young-sil Award’ in April for its micro SAW equipment. Also in May, selected as the only ‘World’s top 10 semiconductor equipment companies in the customer satisfaction survey sector’ among Korean semiconductor companies by Tech Insights, a global semiconductor market research institute.

Meanwhile, HANMI Semiconductor is the second-largest shareholder with a 20.97% stake in HPSP, a semiconductor equipment company listed on the KOSDAQ market on the 15th of last month (10.49% of HANMI Semiconductor, 10.49% of DS Kwak, CEO & vice chairman of HANMI). An official from HANMI Semiconductor said, "We expect synergy effects to become a global comprehensive semiconductor equipment company in the future through exchanges between two companies."