Date: 2014. 12. 03 ~ 2014. 12. 05
Place: Tokyo Big Sight, JAPAN

HANMI Semiconductor participated in SEMICON Japan 2014 from Dec. 4th to 6th in Tokyo Big Sight.

There are more than 725 companies from 14 countries and 60,200 visitors participated for the exhibition.

Especially in this exhibition, HANMI Semiconductor displayed FLIP CHIP BONDER-A110 ULTRA that greatly improves in accuracy. It had received high attention from major Japan packaging companies such as ROHM, KYOCERA, etc.

It was an great opportunity to show HANMI Semiconductor's high technology and to increase awarness for Japan customers which?have high entery barriers market.

HANMI Semiconductor will participate in SEMICON Korea 2015 in February and will continue to conduct an aggressive marketing.