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SEMICON CHINA 2013 |
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2013-03-29 |
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Date: 2013.03.19 ~ 2013.03.21
Place: New International Exhibition Center (SNIEC), Shanghai
From March 19th to March 21st, HANMI Semiconductor participated in SEMICON CHINA 2013.
More than 1000 corporations and 51,238 visitors around the world gathered in one place to join this rare event, the 25th anniversary of SEMICON held in Shanghai.
In SEMICON CHINA 2013, HANMI Semiconductor displayed its new FLIP CHIP BONDER equipment for the first time, making a great appeal to our customers.
What is more, HANMI Semiconductor received demonstration request from our customers, right after SEMICON CHINA 2013 ended, shipping some equipment to their companies to meet their needs
Besides, many leading Semiconductor companies visited HANMI Semiconductor’s booth at the fair, showing their willingness to purchase the equipment. We believe that this enthusiastic response will lead to purchase order in the future.
To further develop our good performance and competitiveness, HANMI Semiconductor will also join SEMICON TAIWAN 2013 in the upcoming September, continuing our active advertising and marketing activities abroad.
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