HANMI Semiconductor announced on the 23rd that it has purchased land for a new factory with a total floor area of 33,058㎡ to increase the production capacity of its flagship semiconductor equipment.

The purchase amount of the land that HANMI Semiconductor has secured this time is about USD 21 million. The land is right next to the existing third plant, ‘BONDER FACTORY’, located in Juan National Industrial Complex in Seo-gu, Incheon. HANMI Semiconductor plans to start the expansion of the plant early next year and complete it by the end of the same year.

Currently, HANMI Semiconductor manufactures TC BONDER by using 210 core component processing machine tools at six plants with a total floor area of 73,000㎡ at its headquarters in Incheon. It can produce 264 TC BONDER units (22 units per month) per year in this year.

If the new plant is built on the newly secured land, processing and production machine tools for core components worth USD 15 million will be added by 2025. Therefore, HANMI Semiconductor is expected to significantly shorten the delivery date by realizing 420 units (35 units per month), the world’s largest TC BONDER production capacity. In addition, the company is more likely to achieve its 2026 sales target of USD 1.4 billion.

Kwak Dong Shin, vice chairman of HANMI Semiconductor, said “Due to the rapid growth of the artificial intelligence (AI) semiconductor market, demand for HBM (High Bandwidth Memory) is increasing rapidly,” added, “We will steadily prepare production capacity with the launch of next-generation TC BONDER to realize customer satisfaction so that we can achieve our sales goal of USD 1.4 billion in 2026.”

Meanwhile, since the establishment of the Ministry of Intellectual Property in 2002, HANMI Semiconductor has applied for more than 120 HBM equipment patents so far by focusing on protecting and strengthening intellectual property rights through 10 experts.