HANMI Semiconductor participates in the ‘2024 SEMICON Korea’ exhibition at COEX in Samseong-dong, Seoul.

According to HANMI Semiconductor on January 31, ‘7th Generation new micro SAW & VISION PLACEMENT 6.0 GRIFFIN,’ which is scheduled to be released in the first half of this year, launched for the first time at the SEMICON Korea exhibition.

“This year will be the first year that DUAL TC BONDER, an essential process equipment for AI semiconductor high-bandwidth memory (HBM), contributes to sales in earnest,” an official in HANMI Semiconductor said. “This SEMICON Korea is an important event to mark the beginning.”

HANMI Semiconductor won more than USD 75 million in DUAL TC BONDER from SK Hynix in the second half of last year. HANMI Semiconductor has set a goal of achieving USD 377 million in sales this year and USD 487 million next year with strong orders of DUAL TC BONDER.

Meanwhile, SEMICON Korea, which is held at the COEX exhibition hall in Samseong-dong, is Korea’s largest semiconductor industry exhibition which began in 1987, and domestic and foreign companies showcases the latest semiconductor equipment, materials and related technologies. Along with the exhibition, semiconductor technology symposiums, market trend forums and purchase consultations will be held.