HANMI Semiconductor, a semiconductor equipment company, has delivered its third-generation hyper-model ‘DUAL TC BONDER GRIFFIN,’ which is essential process equipment for HBM (high-bandwidth memory) installed in artificial intelligence (AI) semiconductors for the first time.

According to HANMI Semiconductor on the 28th, the ‘DUAL TC BONDER GRIFFIN’ equipment will be delivered to global semiconductor company through its release.

DS Kwak, vice chairman of HANMI Semiconductor, explained “‘THIS IS JUST BEGINNING.’ The DUAL TC BONDER GRIFFIN, which was first shipped out, is a third-generation hyper-model that applies the latest technology, and it is a bonding equipment that functions to stack semiconductor chips manufactured with ‘TSV’ method on wafers.”

Also, “It is characterized by a significant improvement in the productivity and precision of semiconductor chip stacking for HBM production,” he said, “In the future, the DUAL TC BONDER will be sold in accordance with customers’ needs and specifications.”

HANMI Semiconductor recently announced its goal of annual sales be 350 million dollars next year. In addition, it is expected that its performance will reach 550 million dollars in Y2025.

In this regard, according to foreign media, NVIDIA, BROADCOM and AMD are currently leading the demand for HBM, but Intel, Google and Amazon are also planning to increase the procurement of AI semiconductors for servers in the future. As such, global semiconductor companies are expected to accelerate their investment in expanding post-process (packaging) lines in preparation for soaring demand for HBM.

Meanwhile, HANMI Semiconductor announced on the 13th of this month that it will allocate 0.33 dollar per a share, a total of 31 million dollars, in fiscal 2023. This is the largest since its foundation. HANMI Semiconductor plans to expand its shareholder-friendly dividend payout ratio in the future.