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HANMI launches 5th generation Flip chip bonder |
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2020-08-25 |
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https://www.edaily.co.kr/news/read?newsId=01902406625870928&mediaCodeNo=257&OutLnkChk=Y
HANMI announcement on the 25th that it has released fifth-generation 'Flip chip bonder- 5.0' equipment that improves performance after more than three years of research.
Bonder is a function that connects semiconductor chips to PCBs in a circuit. Fifth-generation 'Flip chip bonder- 5.0' allows small and fine processes through solder ball bumping. So, it is mainly used in small IT devices and high- performance semiconductor processes.
Flip chip bonder 5.0 has improved production by applying eight multi die bonding headers. And based on the smart machine function, we have further strengthened precision and convenience. This will lead to positive responses among global high-end chipmakers.
In particular, Flip chip bonder equipment is essential for high-spec non-memory semiconductor processes. HANMI Semiconductor is planning to carry out business activities with Flip chip bonder 5.0, which has strengthened performance compared to its competitors.
SEMI is estimating that volume of semiconductor equipment market will be $70 billion next year in 'Global Semiconductor Fab Investment Trend'. It is also expected that demand for semiconductors will increase significantly next year along with recovery of demand for IT devices, breaking away from the influence of Corona 19.
"Exports accounted for more than 77% of sales over the past 10 years from 2010 to last year," said officials for HANMI Semiconductor. "The sales of 'EMI Shield' equipment are also good due to the expansion of non-face-to- face due to Corona 19 and the strengthening of investments in 5G infrastructure." "We expect the biggest performance this year, surpassing sales of 217.1 billion won recorded in 2018."
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