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HANMI the master of semiconductor equipment specialty, targeting on "Chiwan", expecting Double-digit growth
2017-09-12 5328
 

http://www.edaily.co.kr/news/NewsRead.edy?SCD=JC61&newsid=01167686616059136&DCD=A00306&OutLnkChk=Y ←go into details

 

President of HANMI, Mr. Kim, Min Hyeon attends SEMICON TAIWAN 2017 in Taipei on Sep. 13th.

It’s going to be HANMI’s first exhibition of new equipment with highly improved productivity such as 6th generation VISION PLACEMENT & 3rd generation FLIP-CHIP BONDER.

HANMI has recently established HANMI China after HANMI Taiwan to focus on ‘CHIWAN’ which occupies more than 70% of Global OSAT market.

“We will continuously make escalating results since we are targeting on ‘Chiwan’ market with new equipment like 6th generation VISION PLACEMENT.” said Kim Min Hyeon, the President of HANMI Semiconductor, a Middle-End semiconductor equipment manufacturer in Incheon, South Korea.

On Sep. 8th, He said “A lot of Innovative improvement, especially in terms of throughput, has been made on our equipment like 6th generation VISION PLACEMENT, 3rd generation FLIP CHIP BONDER and so on. Now we are looking forward to showing our products at SEMICON TAIWAN this month.” He also added “This year, we expect to see double-digit sales growth YoY.”

HANMI is a Middle-End semiconductor equipment manufacturer which turned over 166 Billion KRW of sales last year. SEMICON TAIWAN, a global semiconductor equipment & material exhibition, is going to be held in Taipei from 13th to 15th of September, 2017. Approximately 700 global companies and more than 40,000 customers are expected to visit the exhibition.

HANMI’s key product, VISION PLACEMENT is an equipment which can perform total process of semiconductor packages’ sawing, cleaning, drying, inspecting and sorting defective parts. HANMI has been in Global No.1 position in VISION PLACEMENT area with over 70% of global market share. Since 1998, HANMI has kept its leading position in VISION PLACEMENT market.

 Mr. Kim emphasized “6th VISION PLACEMENT has not only increased 40% of its throughput compared to the last model but its performance and reliability has been also significantly improved.” He also stated “We’ll release another key product, 3rd FLIP CHIP BONDER as well, which shows 80% higher productivity than 2nd generation.”

Mr. Kim said that HANMI is strategically focusing on ‘Chiwan’ market. “Both China and Taiwan major OSAT companies take up about 70% of Global OSAT industry.” He explained the importance of ‘Chiwan’ and he said “We established HANMI China earlier this year after we opened HANMI Taiwan last year in order to strengthen market power in ‘Chiwan’ area. We’ll concentrate on making a foothold in ‘Chiwan’.”

In addition, “It is announced that China’s massive state-backed fund will reach about 170 trillion KRW. Currently, 11 front-end semiconductor plants has been under construction in mainland China.” President Kim mentioned. “Global OSAT companies will rapidly increase its CAPEX in accordance with front-end companies. No doubt that demand on OSAT equipment like VISION PLACEMENT will mount up.”