Semicon Taiwan 2013 draws attention to 450mm Wafer and 3D IC technology
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HANMI Semiconductor participated in ‘SEMICON TAIWAN 2013’ held in the Taipei World Trade Center from September 4th to 6th.
A plenty of semiconductor equipment makers took part in ‘SEMICON TAIWAN 2013’ and introduced their technology. HANMI Semiconductor became the center of public attention releasing new equipment of which quality is unparalleled among the other companies.
‘3D VISION INSPECTION-3000’ released for the first time in this exhibition stunned the visitors with two outstanding performances with respect to The Speed and The Accuracy. It is faster twice and more accurate up by 10% compared to the competitors.
In this show, HANMI Semiconductor also launched the 'Flip Chip Bonder-Y90' which is targeting the low-end smart phone market. It proved, in automation, the HANMI's world leading technology in the Flip Chip Bonder Equipment field in the world.
The great achievement from this exhibition will accelerate HANMI's success into the Semiconductor Packaging Market of Taiwan.
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