DATE: 2013. 09. 04 ~ 2013. 09. 06
TWTC Nangang Exhibition Exhibition Hall, Taiwan

HANMI Semiconductor took part in 'Semicon Taiwan 2013' held at the TWTC Nangang Exhibition Hall, Taipei, Taiwan. It attracted 650 world's leading technology companies and 32,000 visitors for 3 days.

In this show, HANMI launched two new equipment : '3D Vision Inspection 3000' which is designed to accurately inspect the semiconductor packaging in 3D and 'Flip Chip Bonder - Y90' which is targeting the low-end smart phone market. Both models successfully got a large attraction of visitors from the world's leading semiconductor packaging companies.

HANMI also held an Investor Relations for analysts, economists, reporters, and institutional investors. HANMI will participate Semicon Japan in December 2013 and Semicon Korea in January 2013 to continue the aggressive marketing activities.