DATE : 17th March 2009 ~ 19th March 2009

Shanhai (New International EXPO Centre), China

SEMICON China 2009 was open at NEW International EXPO Centre, Shanghai, China on March 17 with the newest semiconductor & its manufacturing equipment trend, and future.

HANMI Semiconductor, a global semiconductor assembly & packaging company had good opportunity to introduce our major equipment, Sawing & Placement System, Auto Molding System, and other equipment line- up. HANMI also seized a change to meet & business discuss with lots of customers.