Date: 2015. 09. 02 ~ 2015. 09. 04

Place: TWTC Nangang Exhibition Exhibition Hall, Taiwan

HANMI took a part in 'SEMICON Taiwan 2015' held at the TWTC Nangang Exhibition Hall, Taipei, Taiwan.

HANMI showed upgraded version of VISION PLACEMENT 30000L which is positioning World market share No. 1 for several years and FLIP CHIP BONDER-A110 that has made a big advance in terms of accuracy.

Both models successfully got a whole lot of attraction by visitors from the world's leading semiconductor packaging companies.

HANMI will continue to attend the exhibitions and promote products and company actively for more attention.