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 FLIP CHIP BOND |
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| FLIP CHIP BOND A110 |
使用X-Y Gantry 结构的高精密度
使用Dual Bonding Head的高生产卛
能操作 12inch wafer
非常容易交换 Conversion kit
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| Productivity |
UPH |
5,000 (实际生产卛) |
| Accuracy |
X-Y placement |
±10.0 µm @ 3 σ |
| Chip rotation (θ) |
±0.1° @ 3 σ |
| Bonding Head |
Bonding force |
1N ~ 25N (每1N可操作程序) |
| Footprint |
Dimension (WxDxH) |
1,730mm x 1,200mm x 1,500mm |
| weight |
3,000kg |
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| * HANMI 半导体产品受工业产权保护
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> 产品展示 > 
