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半导体设备
VISION INSPECTION
TRUE 3D Inspection on ANY Type of Packages
最先进的球共面性,凹痕,破损检查
QFN 表面高精度检查
行间的精确测量
UNIVERSAL Handler Design with Various Offloading Options
托盘 / 料管 /tape and reel/canister (选件)
Fidle-Proven Package Handling Reliability
吸 / 放型式
Extremely Easy & Quick Change-over
Auto-Changeable Field-df-View's to cover a Wide Range df Package Types and Sizes (3FOV's Standard)
Advanced Vision Hadware for High Inspection Performance
* HANMI 半导体产品受工业产权保护