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 FORM GRINDING-3000 |
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| FORM GRINDING-3000 |
UPH ：最小 5,000
高的生产力应归于多个体处理
卓越的成型磨削切割质量 ( 粗糙度：最大 1.5Ra)
高效的清洗和烘干系统
先进的视觉检查系统和筛选功能
最小的成本 |
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| for Micro-SD Card, SD Card, MMC, xD Card, SIM Card, SD SIP, TransFlash… Excellent Quality, Roughness : Max 1.5 Ra |
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| Vision Inspection |
1st Vision |
Lead Count, Lead Width, Lead Length, Lead Pitch, Package Size, Dimension, Offset, X-Mark, Chamfer Dimension |
| 2nd Vision |
Wrong Character, Mark Position, X-Mark, Package Size, Chip Out, No Mark, Scratch, Missing Character, Edge Around Angle |
| Dimension |
3,030 × 1,780 × 1,800 (L × W × H) |
| Weight |
2,400 KG |
| Power supply |
220~440VAC, 50/60Hz |
| Air supply |
5Kgf/cm2 at 800L/min |
| Water supply |
3Kgf/cm2 at 6L/min |
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| * HANMI
半导体产品受工业产权保护 |
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> 产品展示 > 
