Hanmi Semiconductor

SAWING & PLACEMENT-3800L

高产能： 17,000 UPH

精准的个体放置

live bug unit handling with flip-over function

(BGA: ball up cutting & ball down off-loading)

Smart& individual rotation of off-loading picker with position compensation function

容易和快速的转换：最大 . 9 分钟

已安装高性能的视觉检测系统

for MLP, MLF, QFN, QLP, BCC, Mini BGA, LFBGA, SS-BGA, EBGA, CA-BGA, TBGA, FBGA, MW-BGA, UL-BGA, LGA....

Vision System	1st Vision	Orientation, package type, turnover inspection
	2nd Vision	package outline dimension inspection , ball quality inspection, lead/Pad quality inspection
	3rd Vision	X-mark inspection, Mark quality inspection
		Vision 6-side inspection (optional item)
Dimension	3,150x1,600x1800mm (L x W x H)
Power supply	AC 220~480V, 3Phase, 50/60Hz
Air supply	5 kgf/cm 2
Water supply	3 kgf/cm 2
Substrate	Width : 35~75mm Length : 170~250mm

* HANMI 半导体产品受工业产权保护