HANMI Semiconductor's
Highest Dividend Since
Its
Foundation..."Expanding
sales of HBM equipment"
HANMI Semiconductor
announced on the 13th
that they will allocate
420 won per share, a
total of 40.7 billion
won, as cash dividends
for fiscal 2023. This is
the largest since the
company's founding,
exceeding the total
dividend of 29.7 billion
won in 2021.
Dividends were revised as
of March 7 every year in
accordance with the
revision of the articles
of incorporation in
March. Shareholders
seeking dividends must
hold shares of HANMI
Semiconductor on March 7,
2024.
DS Kwak, vice chairman of
HANMI Semiconductor,
said, "Starting with the
announcement of the
largest dividend of 40.7
billion won, we will
continue to expand our
dividend payout ratio in
the future."
In September this year,
HANMI Semiconductor
received orders of about
101.2 billion won from SK
Hynix for the first time
in a month, reviving its
growth. This is due to
the continued orders for
the third-generation
hypermodel "DUAL TC
BONDER GRIFFIN" for
essential production
equipment for high-
bandwidth memory(HBM) for
an artificial
intelligence(AI) memory.
DS Kwak also said, "We
aim to have annual sales
of 450 billion won in
2024, and we expect to
have annual sales of 650
billion won in 2025."
According to the
industry, HBM's
production is also on the
rise as orders centered
on large fabless
companies such as NVIDIA
and AMD increase. SK
Hynix announced an
investment of 10 trillion
won in 2024 to expand HBM
facilities, and Samsung
Electronics also decided
to increase production by
more than 2.5 times by
advancing investment in
expanding packaging lines
in preparation for a
surge in HBM demand.
Micron is also planning
to mass-produce HBM3E
within the first quarter
of next year as it has
completed preparations
for mass-production.
Meanwhile, DS Kwak paid
30 billion won in
treasury stock to
employees in October.