HANMI Semiconductor, a semiconductor equipment company, announced on the 2nd that it has recently opened a “Bonder Factory” to expand its production capacity of “DUAL TC BONDER,” an essential process equipment for High Bandwidth Memory (HBM) for artificial intelligence (AI) semiconductors.

HANMI Semiconductor built a bonder factory using third of its five factories with a total size of 66,248㎡. Third factory has a large-scale of clean room that can assemble and test about 50 semiconductor equipment at the same time. It provides an optimal environment for producing TC Bonder and Flip-chip Bonder, including Dual TC Bonder.

An official from HANMI Semiconductor said, “The global semiconductor industry is expected to recover carefully after confirming its low point in the second half of this year. As key global companies that produce artificial intelligence semiconductors are major customers of HANMI Semiconductor, we tried to prepare for production capacity (CAPA) on changing market demand.”

Founded in 1980, HANMI Semiconductor was the only Korean semiconductor equipment company to participate in the 2023 SEMICON China exhibition held in Shanghai, China last month as an official sponsor. It also plans to participate in the 2023 SEMICON Taiwan exhibition in Taipei, Taiwan, in September as an official sponsor and continue its global marketing activities.