HANMI Semiconductor announced on 3rd, Feb. that it participated in the 2023 Semicon Korea Exhibition with ‘Full Automation Wafer micro SAW’ (micro SAW W1121α), a SAW equipment for wafer cutting.

The 2023 Semicon Korea Exhibition held at COEX exhibition hall in Samsung-dong was attended by 450 semiconductor chip producers and materials, parts and equipment companies.

A person from HANMI Semiconductor said, “The wafer micro SAW is a fully automation standalone 12-inch wafer SAW equipment that cuts wafers attached on tapes. It is a product that combines precision processing, vision and setting technology based on the power and know-how of HANMI Semiconductor over 42 years.”

Also, “We provide a two- year warranty on all micro SAW equipment,” he said. “We expect to generate new sales through micro SAW equipment.”

Wafer micro SAW is the sixth SAW model released by HANMI Semiconductor. Founded in 1980, HANMI Semiconductor has 42 years of experience. It succeeded in localizing SAW equipment in June last year through ‘Dual- Chuck micro SAW’ (micro SAW P2101).