[edaily reporter Kang Kyung-rae] HANMI Semiconductor(042700) announced on the 21st that they has supplied "micro SAW & VISION PLACEMENT 8.0" which combines ‘micro SAW P1201’, high-end PCB cutting equipment for ‘Advanced Packaging’ used in next-generation CPU(central processing unit) and GPU(graphics processing units) to a domestic semiconductor company for the first time.

Kwak Dong-shin, vice chairman of HANMI Semiconductor, said, the P1 series released this time following the dual chuck 'micro SAW P2' series introduced in June this year, is equipment for jumbo PCBs that cut 500mm x 500mm panels (20- inch wafers). We succeeded in self- development to reduce dependence on Japan's Disco (market capitalization of about 11.6 trillion won(USD 10.3 bil)), which has dominated the global market in semiconductor package cutting equipment, and overcome the delay in delivery for more than a year. Furthermore, we promote the excellence of Korean semiconductor equipment and hold more orders from domestic and foreign semiconductor companies.

Vice Chairman Kwak continued, Internalization of equipment production is expected to shorten the delivery date by more than half compared to competitors, and increase demand for 'Advanced packaging’ PCB cutting by global IDM(Integrated Device Manufacturer) and semiconductor post- processor OSAT(Outsourced Semiconductor Assembly and Test). On top of that, by combine with HANMI semiconductor’s ‘VISION PLACEMENT’ the world's No. 1 sales equipment, it will contribute to explosive sales growth from the second half of this year to next year thanks to increased demand for GPUs and CPU applied to 5G, artificial intelligence, metabuses, data centers, and self-driving cars.

Meanwhile, Foreign securities firm Macquarie Securities Research, predicted that HANMI Semiconductor will record 33% profit ratio this year with 378 billion won (USD 320 mil) of annual sales and 125.1 billion won (USD 161.5 mil) of operating profit. And also predicted that it will continuously show an upward tendency until 2024.