HANMI Semiconductor (042700), a Middle-End semiconductor equipment manufacturer, announced On Sep. 13^th that they have released Flip Chip Bonder-3.0 to the public. According to HANMI’s announcement, far better productivity is certainly guaranteed with new FC Bonder-3.0 thanks to 3 years of R&D effort on it. This new equipment is now on display at SEMICON TAIWAN 2017, a global semiconductor equipment & material exhibition.

“Various functions have been upgraded to get better throughput and accuracy than the previous one. Thin & small die handling performance has been reinforced as well.” said President Kim Min Hyeon. “8 major functions, including self-diagnosis system for user convenience and enhanced vision inspection system, have been improved.” He added, “We expect positive reception from Taiwan companies which have largely produced high-end semiconductor packages.”

HANMI showed their key product, New Vision Placement-6.0 with FC Bonder-3.0. Vision Placement is HANMI’s technological integration result with its 207 patent and it recorded over 2,000 pieces in sales to the domestic and overseas market since 1998.

In 1998, HANMI first released Vision Placement to the market and has been in Global No.1 position in VISION PLACEMENT area for 13 consecutive years from 2004. Mr. Kim indicated “We are also going to show ‘TSV Dual Stacking TC Bonder’ and ‘Wafer Marking’ equipment with high added value. Since global semiconductor industry is expected to grow steadily along with IoT & AI development, our business prospect is very much optimistic.”

Meanwhile, Taiwan has more than 60% of semiconductor back-end market share with world’s biggest Semiconductor Foundry and ‘OSAT’ (Outsourced Semiconductor Assembly and Test) companies. HANMI established its subsidiary ‘HANMI Taiwan’ January 2016 and has been providing intimate customer service in the field.