HANMI Semiconductor will sell mobile equipment 20 times more than ever in this year!
Bringing out the new equipment, FLIP CHIP BONDER…45 million dollar goal for this year.
http://www.mt.co.kr/view/mtview.php?type=1&no=2012123112274889843&outlink=1 -> Go into details
HANMI Semiconductor is planning to enhance the semiconductor business for mobile machine in this year.
Newly released FLIP CHIP BONDER-A110 performs flip chip packaging for semiconductor chips on the main purpose of smart-machine-use, as it attains a world-class level when it comes to the production and accuracy.
For many Years to come, as increasing demand for mobile machine such as smart phone, tablet PC etc, we are anticipating the flip chip bonder demand increasing as well. And it would be the time for us to be flexible and activate about market changes.
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