SAWING & PLACEMENT-30000L

HANMI Semiconductor released the 5th generation S&P with the improved productivity and capacity.

http://www.etnews.com/news/device/device/2752968_1479.html <- Go into details

HANMI Semiconductor has newly released the 5th generation SAWING & PLACEMENT-30000L.

Our Sawing & placement equipment , which combines every 6 function of semiconductor assembling processes, such as dicing, cleaning, drying, sorting, inspecting and loading into one currently let us take the first place in the world’s market share.

For this time, the 5th generation equipment SAWING & PLACEMENT-30000L has 20000 UPH, and been improved over than 50% of productivity better than 4th generation equipment.

Also, it can handle both live-bug and dead-bug for user’s convenience having 3D vision inspection function to sort good products out after packaging.

As releasing Sawing & placement 30000L, HANMI Semiconductor is willing to upgrade the class of the world’s S&P equipment again.