HANMI Semiconductor announced on the 8th that its Chairman, Kwak Dong Shin, attended the groundbreaking ceremony for Micron Technology’s new high-bandwidth memory (HBM) packaging facility in Singapore.

Chairman Kwak, along with key executives, was invited to the ceremony held earlier today at the Woodlands in Singapore.

While specific details of the plant’s scale were not disclosed, the new facility will focus on producing high-spec HBM, a key component for AI Semiconductor used by companies such as NIVIDIA and Broadcom. The plant is expected to be completed around 2027.

Currently, Micron manufactures HBM at its facilities in Taiwan. With this new HBM-dedicated plant in Singapore, Micron also plans to begin operations at additional HBM facilities in Idaho, U.S., in 2026, as well as in New York, U.S., and Hiroshima, Japan by 2027.

Sanjay Mehrotra, CEO of Micron, stated during the company’s Q3 earnings call in last year, “We aim to increase our HBM market share to over 20% by 2025,” which is more than double the approximately 9% market share forecasted for 2024.

According to market research institute TrendForce, as of the end of last year, Micron’s HBM production capacity was around 20,000 wafers per month. This capacity is expected to increase to 60,000 wafers per month by the end of this year, helping Micron close the gap with competitors and increase its market share.

Meanwhile, HANMI Semiconductor, the world leader in TC BONDER for HBM, set to begin supplying Micron starting in April 2024. The company anticipates that its TC BONDER sales will increase in line with Micron’s expanding HBM production capacity.

Yong-Hwan Lee, a CGSI Securities analyst, noted in a report on December 10th last year, “By 2025, SK Hynix and Micron Technology are expected to aggressively expand their HBM production capacity, which will play a crucial role in driving the growth of HANMI Semiconductor’s TC BONDER sales.”

Founded in 1980, HANMI Semiconductor is a global company with 44 years of experience in the semiconductor equipment market. Over the past decade, the company has averaged over 76% of its sales from exports and serves approximately 320 clients worldwide.

Notably, since the establishment of its Intellectual Property Division in 2002, HANMI has filed over 120 patents for HBM equipment, demonstrating its unparalleled technological leadership on a global scale.