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HANMI Semiconductor, 7th Plant for HBM TC BONDER Groundbreaking Ceremony
2025-01-06 294
 

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HANMI Semiconductor, 7th Plant for HBM TC BONDER Groundbreaking Ceremony

HANMI Semiconductor announced on the 6th that it held a groundbreaking ceremony for its 7th plant, which will specialize in High Bandwidth Memory (HBM) TC BONDER.


The 7th plant will be a two-story building with a total floor area of 14,400 square meters. It will produce high-spec HBM3E with 12 or more stack for global clients like NVIDIA and Broadcom.


HANMI Semiconductor, the world’s NO.1 provider of TC BONDER for HBM, has secured a production line spanning a total area of 89,523 square meters. Based on revenue, the company is capable of generating up to KRW 2 trillion.


Chairman Kwak Dong Shin of HANMI Semiconductor stated, “With the rapid growth of the artificial intelligence (AI) market, the global HBM market is expanding exponentially every year.” He added, “The AI market is projected to grow exponentially, and our equipment currently produces over 90% of the HBM3E 12-layer products supplied to leading global AI players like NVIDIA and Broadcom. HANMI Semiconductor is expected to grow rapidly as well.”


“The 7th plant is scheduled for completion in the fourth quarter of this year,” said Chairman Kwak. “We began construction to stay ahead of the growing demand in the HBM market. The plant will produce HBM TC BONDER, BIG DIE TC BONDER for AI 2.5D packages to be launched this year and next-generation products like FLUXLESS BONDER and HYBRID BONDER for HBM4 production.”


He also expressed his gratitude, saying, “I am always thankful to our 800 employees who are working together to achieve this year’s sales target of 1.2 trillion KRW and next year’s target of 2 trillion KRW.” Creating a better company for our employees is the role of CEO.”


According to market research institute TrendForce, the global HBM market size is expected to surge by 157% from USD 18.2 billion in 2024 to USD 46.7 billion in 2025.


Last year alone, HANMI Semiconductor signed a stock repurchase trust agreement worth KRW 200 billion and cancelled treasury stocks worth KRW 57 billion through two transactions. Over the past three years, the company has signed stock repurchase trust agreements totaling KRW 280 billion to enhance shareholder value. Chairman Kwak himself directly purchased shares worth approximately KRW 37.3 billion from the market since 2023, demonstrating his confidence in HANMI Semiconductor’s future value.


Founded in 1980, HANMI Semiconductor is a global company with around 320 customers worldwide, leveraging its unparalleled expertise in the semiconductor market. Since establishing its Intellectual Property Division in 2002, the company has focused on strengthening its intellectual property rights with a team of over 10 specialists, filing over 120 HBM equipment patents to date. With its unique technological capabilities and product durability, HANMI semiconductor is expected to further enhance its competitive edge.