On the 16th, HANMI Semiconductor released ‘TC BONDER GRIFFIN 1.0 SB’, a new equipment for next-generation high-bandwidth memory (HBM) production that will be installed in artificial intelligence (AI) semiconductors.

With the launch of the new equipment, Vice Chairman Kwak Dong Shin has been promoted as chairman for the first time in 17 years. Since joining HANMI Semiconductor in 1998, Chairman Kwak Dong Shin has worked for more than 26 years to lead the company’s growth.

Based on continuous investment in R&D, Chairman Kwak Dong Shin put customer satisfaction as the top priority and made every effort to provide differentiated products and services. He tried to create a company with a simple and systematic system. The system was established to complete semiconductor equipment through careful and meticulous processes.

For HANMI Semiconductor to produce an equipment, a master with more than 25 years of experience must undergo an entire process of 1,000 kinds of examination through six times of inspections in stages including processing, assembly, wiring and testing. Led by chairman Kwak Dong Shin, HANMI Semiconductor succeeded in developing TC BONDER, an essential HBM processing equipment for AI semiconductors. It has become Korea’s leading semiconductor equipment company with a market value of more than KRW 8 trillion.

“With the rapid growth of the AI market, the global HBM market is exploding every year,” Chairman Kwak Dong Shin said. “Blackwell, the next-generation product of NVIDIA, an AI semiconductor leader, is also produced with TC BONDER of HANMI Semiconductor.” “The status and competitiveness of HANMI Semiconductor, which holds the world’s largest share of HBM TC BONDER, remain unchanged,” he said. “The newly introduced TC BONDER GRIFFIN SUPER BONDING HEAD is a new TC BONDER product for next-generation HBM production.”

“The productivity and precision of stacking semiconductor chips have improved significantly by applying the new bonding head,” he said. “As it is actively used to produce next-generation HBMs by semiconductor customers around the world, it will greatly contribute to increasing sales next year.”

Chairman Kwak Dong Shin added, “We are selecting agents that can establish a U.S. corporation and provide after-sales service (A/S) to local customers in the U.S. for local customer close service, which will emerge as a major customer in the AI semiconductor market in preparation for the expansion of demand in the AI-only chip market by U.S. big tech companies.”

HANMI Semiconductor signed a trust contract to acquire treasury stocks worth KRW 200 billion this year. Over the past three years, HANMI Semiconductor has signed a trust contract to acquire treasury stocks worth a total of KRW 280 billion, increasing shareholder value. Chairman Kwak Dong Shin personally acquired treasury stocks worth about KRW 37.3 billion from the market since last year. He expressed confidence in the future value of HANMI Semiconductor.