FLIP CHIP BONDER-A110

HANMI Semiconductor, as the first led Flip chip bonder to be localized in Korea.

http://www.etnews.com/news/device/device/2698837_1479.html<- Go into details

HANMI Semiconductor achieved the localization of Flip chip bonder equipment for flip chip packaging as the first over many companies in Korea.

Flip chip packaging has been regarded as the major one among the current semiconductor manufacturing technologies for smart devices.

Based on the point that the flip chip packaging has adopted the producing method of connecting Die and Substrate by the use of Shoulder-ball bumper, which leads to the minimization of Semiconductor size and the maximization of response time within the Semiconductor, compared to the conventional method of wiring connection.

HANMI Semiconductor FLIP CHIP BONDER-A110 released recently has over 6000UPH capacity which is certainly superior to its competitors UPH 3000~4000.

Reach to 6micron of the accuracy, HANMI Semiconductor enhences the degree of accuracy more than 40% after all.

Just it is, HANMI Semiconductor is expecting the world’s best ultimate equipment FLIP CHIP BONDER-A110 would be the new growth power by carrying on the reputation of SAWING & PLACEMENT in the world.