HANMI Semiconductor announced on the 12th that they have signed a trust contract to acquire treasury stocks worth KRW 40 billion.

The contract period is from today to May 12th, 2025 and the contracting agency is SAMSUNG Securities.

Kwak Dong Shin, CEO & Vice chairman of HANMI Semiconductor, said, “HANMI Semiconductor is the main supplier of TC BONDER for HBM (High Bandwidth Memory) production of SK Hynix and Micron Technology in the U.S., and maintains its position as the world’s NO.1 market share by maximizing customer satisfaction based on constant efforts and technology.”

The trust contract to acquire treasury stocks is understood to have been made based on confidence in the future value of HANMI Semiconductor along with the increase in shareholder value and the growth of the artificial intelligence semiconductor market.

As a result, HANMI Semiconductor signed trust contracts to acquire treasury stocks worth a total of KRW 280 billion over the past three years with KRW 200 billion in 2024 following KRW 50 billion in 2022 and KRW 30 billion in 2023, and has continued to practice to enhance shareholder value by retiring 1,926,120 shares (about KRW 40 billion based on book value).

Founded in 1980, HANMI Semiconductor has applied for more than 120 HBM equipment patents including 111 patents so far, focusing on protecting and strengthening intellectual property rights through more than 10 professionals since the establishment of the Intellectual Property Department in 2002. Based on this, it is analyzed that it will gain the upper hand with its unique technology and durability, and further increase the competitiveness of its equipment.